Product Name:Aluminum Heat Sink Die Casting Mold

Aluminum Heat Sink Die Casting Mold

  • Suitable for heat sink housings of LED lights, power modules, controllers, and inverters.
  • The product features dense cooling pins to increase heat dissipation area.
  • The mold requires good filling, venting, and balanced cooling performance.
  • Suitable for electronics, lighting equipment, communication devices, and industrial control products.

Product Description:

Specification Item Details
Product Name Aluminum Heat Sink Die Casting Mold
Product Type Heat Sink Mold / Heat Dissipation Housing Mold / Aluminum Die Casting Mold
Mold Category Precision Die Casting Mold / Aluminum Die Casting Mold
Applicable Process High Pressure Die Casting, Cooling, Ejection, Trimming, Secondary Machining
Applicable Material ADC12, A380, A360, Al-Si Alloy, Aluminum Alloy
Mold Structure Core and Cavity, Cooling Pin Forming Structure, Gating System, Venting System, Cooling System, Ejection System
Features Large Heat Dissipation Area, Dense Cooling Pins, High Forming Efficiency, Suitable for Mass Production
Application LED Lighting, Power Modules, Controllers, Communication Equipment, Industrial Electrical Equipment
Customization Cooling Pin Quantity, Height, Hole Position, Mounting Structure, and Size Customization Available
Production Mold Design, Machining, Trial Optimization, and Die Casting Production Available

This product is an aluminum heat sink die casting mold, mainly used to produce aluminum heat dissipation components with dense cooling pins, columns, or fins. These products are commonly used in LED lighting, power modules, industrial controllers, communication equipment, and electronic housings. Due to the long and dense heat dissipation structures, mold design must carefully control the gating system, venting system, mold temperature balance, and ejection stability to avoid short shots, porosity, broken pins, deformation, and sticking. This mold type is suitable for mass production and can be customized according to heat dissipation requirements, mounting structure, and product size.